Molecular dynamics of rapid melting in a copper-silver alloy


A copper-silver alloy (64% Cu / 36% Ag atomic ratio) is simulated by molecular dynamics. The alloy is subjected to rapid linear heating protocols from room temperature to 2100 K at several ramp rates of the order  K/ps. Numerical evidence for a first-order melting transition at 1.19 x 10^3 K is observed. This elevated value is suggested to be the result of high pressures in the microscopic sample.